Electronic Renaissance Program: Expected commercial and defense interests will be realized in 2025-2
- Release on :2018-07-06
According to publicly available information, the e-Renaissance program will focus on developing new materials for electronic devices, developing new architectures that integrate electronic devices into complex circuits, and innovating in hardware and software design.
All of this is to be more efficient than ever before to turn microsystem design into a reality. This also means that the technical focus of the e-Rejuvenation Program is to ensure continuous improvement and enhancement of electronic performance without scaling.
The new research work will complement the Joint University Microelectronics Program (JUMP) that DARPA created last year. Here, it is also necessary to mention this JUMP plan.
JUMP is the largest underlying electronic research work jointly funded by DARPA and industry alliance semiconductor research companies. It is estimated that 150 million US dollars will be invested in 5 years, and it will be combined with MIT, Berkeley, and many of the top universities and research institutes in the University of California. It has set up 6 different research centers and explores 6 different directions. It is a multidisciplinary. The long-term, large-scale cross-domain cooperation program aims to significantly improve the performance, efficiency, and capabilities of various commercial and military electronic systems.
According to the public information of the JUMP program, these research and development efforts should “provide an unparalleled technological advantage for the US Department of Defense in advanced radar, communications, and weapon systems, bringing advantages to the military and industrial sectors, and for the US economy and future. Economic growth, providing unique information technology and processing capabilities that are critical to business competitiveness."
The JUMP program focuses on mid- to long-term (8 to 12 years) exploratory research, and the expected defense and commercial value will be realized in the timeline . The Alliance is committed to focusing resources on high-risk, high-yield, long-term innovation research, accelerating the productivity growth and performance enhancement of electronic technologies and circuits and subsystems to address existing and emerging challenges in electronics and systems technology.
Another big game in the United States: Reinvigorating the chip industry in five years and investing more than $2 billion!
ERI plan map released in September 2017
Look at ERI again. If JUMP is a plan that focuses more on basic and research exploration, ERI is more practical and closer to industry. ERI's three major concerns:
Developing new materials for electronic devices: Explore the use of unconventional circuit components rather than smaller transistors to dramatically improve circuit performance. Silicon is the most common microsystem material. Compound semiconductors such as silicon germanium also play a role in certain applications, but the functional flexibility of these materials is limited. ERI will show that the periodic table provides a large number of candidate materials for next-generation logic and memory components. The research will focus on integrating different semiconductor materials on a single chip, "sticky logic" devices that combine processing and storage functions, and vertical, rather than planar, integrated microsystem components.
Develop a new architecture that integrates electronic devices into complex circuits: Explore circuit structures that are optimized for the specific tasks they perform. The GPU is the foundation for continuous progress in machine learning, and GPUs have demonstrated substantial performance gains from dedicated hardware architectures. ERI will explore other opportunities, such as reconfigurable physical structures that can be adapted to the supported software needs.
Innovate in hardware and software design: Focus on developing tools for rapid design and implementation of dedicated circuits. Unlike general-purpose circuits, dedicated electronic devices can be faster and more energy efficient. Although DARPA has been investing in these application specific integrated circuits (ASICs) for military applications, the development of ASICs can cost a lot of time and expense. New design tools and open source design paradigms can be transformative, enabling innovators to quickly and inexpensively create specialized circuits for a variety of commercial applications.
Recently discussed on the DAC 2018, it is the third point in the ERI program, two programs for flexible design and development of chips. Next at the July ERI summit, more details will be disclosed on other plans. Xinzhiyuan will also pay close attention, so please wait for the follow-up report.
Chappell said: "The ever-increasing and increasingly complex microelectronics technology, as well as the computing, communication, navigation and countless other technologies that rely on these electronic devices, are surprisingly slow, but they occur primarily on essentially the same silicon-based approach. ."
“Look at how much the world has changed in the past decade, just by mobile technology. In order to continue this pace of development, even if we lose the benefits of traditional scaling, we need to break away from tradition and accept ERI. All innovation in the new plan."
"We look forward to cooperating with the commercial sector, defense industry base, academia, national laboratories, and other innovation hotbeds to open the next electronic revolution."